Advanced packaging technologies jobs in Singapore
Advanced packaging technologies is a skill Singapore companies hire for, in demand at 6 companies that also need Data Analysis, HBM, DRAM and NAND.
12 live jobs ↑29% 29d6 companies
Demand by categoryJobs
Advanced Packaging Technology Development (APTD) Process Technical Specialist
Micron Technology
Estimated salary
~S$5k–8.5k/mo
Low competition
Senior Engineer, Advanced Package Metrology-Real-Time Defect Analysis
Micron Technology1 North Coast Drive
Estimated salary
~S$6k–7.5k/mo
Low competition
Senior Engineer Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering
Micron Technology1 North Coast Drive
Estimated salary
~S$6k–7.5k/mo
Normal competition
Lead Research Engineer I, FOWLP Integration, Adv Pkg, IME
A*STAR - Agency for Science, Technology and Research2 Fusionopolis Way
Estimated salary
~S$7k–10k/mo
Low competition
Lead Research Engineer I, Process Integrator, FOWLP, Adv Pkg, IME
A*STAR - Agency for Science, Technology and Research
Estimated salary
~S$7k–9k/mo
Low competition
Strategic Program Manager
STATS ChipPAC
Estimated salary
~S$5.5k–10.5k/mo
Very high competition
Manager, Process Engineer (Deposition)
Applied Materials
Estimated salary
~S$6k–9k/mo
Normal competition
Engineer, Back-end Operation
STMicroelectronics
Estimated salary
~S$4k–6.5k/mo
Normal competition
Research Engineer (Temporary Bonding and Debonding) (APM), IME
Institute of Microelectronics
Estimated salary
~S$4.5k–5.5k/mo
Low competition