Flip chip jobs in Singapore
Flip chip is a skill Singapore companies hire for, in demand at 8 companies that also need SPC, DOE, NPI and JMP.
12 live jobs ↑75% 29d8 companies
Senior Scientist II, Advanced RF Packaging and Integration, IME
Institute of Microelectronics
Estimated salary
~S$8.5k–9k/mo
Low competition
Senior /Lead Research Engineer (FOWLP/2.5D/3D Package Integration) (HI), IME
Institute of Microelectronics
Estimated salary
~S$7k–9k/mo
Low competition
Senior Research Engineer (Interconnect & Assembly Integration), APM, IME
Institute of Microelectronics
Estimated salary
~S$7k/mo
Low competition
S
Senior / Process Associate Engineer
STATS ChipPAC5 Yishun Street 23
Disclosed salary
S$2.5k–3.5k/mo
Normal competition
Package Design Engineer
Broadcom1 Yishun Avenue 7
Estimated salary
~S$7k–8k/mo
Low competition
Application / Process Engineer - Die Bond Tools
Capcon Singapore1 North Coast Avenue
Disclosed salary
S$3k–6k/mo
Normal competition
Global OSAT Operation Engineering
NXP Semiconductors
Estimated salary
~S$4k–5.5k/mo
Normal competition
Senior Quantum 3D Integration and Packaging Engineer
Applied Materials
Estimated salary
~S$7k–10k/mo
Low competition
Senior Engineer I, Operations Engineering-Mfg Eng-AS
K&S Careers23A Serangoon North Avenue 5
Estimated salary
~S$6k–7.5k/mo
Normal competition